TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources said TSMC has imposed strict confidentiality controls across the CoPoS supply chain, requiring Taiwan-based equipment and materials partners to sign agreements that prevent technology leakage and limit supply to TSMC for several years after mass production begins.
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